Advanced packaging
Connect manufacturing requirements with the recommended process, equipment and implementation support.
Application solution
Recommended process
Recommended equipment
Manufacturing challenge
Production requirements must be translated into a controlled process path and suitable equipment configuration.
Start with the material, structure, registration and production targets before selecting equipment.
Connect requirement review, equipment selection, process setup, trial production and ramp support.
Recommended process
A clear path from requirement to verification
Connect requirement review, equipment selection, process setup, trial production and ramp support.
Requirement review
Equipment selection
Process setup
Trial production
Ramp support
Key capabilities
Capabilities connected to the application
Organize equipment and process capability around the manufacturing result that must be controlled.
Application requirement review
Process and equipment matching
Implementation verification
Production continuity support
Recommended equipment
Platforms matched to this manufacturing route
Equipment selection is connected to the process path and can be refined during application review.
PLP
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
WLP
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
MLC
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
Related solutions
Continue through the application matrix
Explore adjacent manufacturing routes supported by the same equipment portfolio.
PCB manufacturing
Connect manufacturing requirements with the recommended process, equipment and implementation support.
FPC manufacturing
Connect manufacturing requirements with the recommended process, equipment and implementation support.
HDI manufacturing
Connect manufacturing requirements with the recommended process, equipment and implementation support.
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