CELECO
Back to solutions
HDI manufacturing

HDI manufacturing

Connect manufacturing requirements with the recommended process, equipment and implementation support.

HDI manufacturing

Application solution

05

Recommended process

04

Recommended equipment

Manufacturing challenge

Higher interconnect density requires controlled microvias, fine features and reliable layer-to-layer registration.

Start with the material, structure, registration and production targets before selecting equipment.

Connect drilling, direct imaging and verification around the HDI build-up process.

Recommended process

A clear path from requirement to verification

Connect drilling, direct imaging and verification around the HDI build-up process.

01

Stack review

02

Microvia drilling

03

Desmear

04

Direct imaging

05

Verification

Key capabilities

Capabilities connected to the application

Organize equipment and process capability around the manufacturing result that must be controlled.

01

Controlled microvia formation

02

Fine-line direct imaging

03

Reliable layer-to-layer registration

04

Connected process verification

Recommended equipment

Platforms matched to this manufacturing route

Equipment selection is connected to the process path and can be refined during application review.

MAS
MAS

MAS

Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.

NEX
NEX

NEX

Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.

CO₂ Laser
CO₂ Laser

CO₂ Laser

Laser drilling equipment supported by application review, project introduction and local service.

Ultrafast Laser
Ultrafast Laser

Ultrafast Laser

Laser drilling equipment supported by application review, project introduction and local service.

Related solutions

Continue through the application matrix

Explore adjacent manufacturing routes supported by the same equipment portfolio.

PCB manufacturing

PCB manufacturing

Connect manufacturing requirements with the recommended process, equipment and implementation support.

FPC manufacturing

FPC manufacturing

Connect manufacturing requirements with the recommended process, equipment and implementation support.

IC substrate

IC substrate

Connect manufacturing requirements with the recommended process, equipment and implementation support.

CELECO / hdi

Discuss this application

Tell us about your application, equipment requirement or service request.

Contact us