LDW
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
Model
Equipment family
Application fit
Core capabilities
Built around production requirements
Equipment capability is organized around manufacturing requirements, process integration and production continuity.
Application-fit equipment evaluation
Process integration and project introduction
Installation, commissioning and lifecycle support
Implementation path
From requirement to stable production
Connect application review, process verification, equipment integration and lifecycle service as one path.
Review application
Verify process
Integrate equipment
Support production
Application fit
Where this equipment fits
PCB manufacturing
Connect manufacturing requirements with the recommended process, equipment and implementation support.
FPC manufacturing
Connect manufacturing requirements with the recommended process, equipment and implementation support.
Related equipment
Direct imaging
Compare other platforms in the same equipment family.
MAS
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
NEX
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
RTR DE
Direct imaging equipment for PCB, FPC, HDI, IC substrate and advanced packaging applications.
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